Functional Materials Books
Author: MO Salaam
School: Federal University of Agriculture, Abeokuta
Department: General studies
Course Code: GNS203
Topics: Academic libraries, Plagiarism, LIBRARY COLLECTIONS, LIBRARY CATALOGUE, ONLINE PUBLIC ACCESS CATALOGUE, LIBRARY E-RESOURCES, E-library, Study skills, Journals, Reference Materials
Reinforced Concrete Design To Eurocode 2
Author: Bill Mosley, John Bungey, Ray Hulse
School: Bayero University, Kano
Department: Engineering
Course Code: CIV3307
Topics: Reinforced Concrete Design, Design processes, composite action, stress-strain relations, shrinkage, thermal movement, creep, materials specification, Limit state design, Characteristics material strengths, Combination of actions, Load combinations, Beams analysis, Frames Analysis, Shear wall structures resisting horizontal loads, Moments redistribution, Rectangular-parabolic stress block, Triangular stress block, Shear, bond, Torsion, Anchorage bond, span-effective depth ratio, deflection calculation, flexural cracking, Thermal cracking, Shrinkage cracking, Reinforced concrete beams design, Reinforced concrete slabs design, Column design, column classification, slender column design, Foundations design, Retaining walls design, Prestressed concrete, Water-retaining structures, composite construction, Footings, Reinforcement details, Shear connector design
Semiconductor Physics and Devices, 4th edition
Author: Donald Neamen
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, Semiconductor Materials, atomic bonding, quantum mechanics, Statistical Mechanics, Schrodinger’s Wave Equation, Quantum Theory of Solids, energy bands, Electrical Conduction, Drift Current, electron effective mass, Dopant Atoms, Energy Levels, Extrinsic Semiconductor, Charge Neutrality, Carrier Transport Phenomena, Graded Impurity Distribution, Nonequilibrium Excess Carriers, ambipolar transport, Quasi-Fermi Energy Levels, surface effects, Metal–Semiconductor, Semiconductor Heterojunctions, tunnel diode, Schottky Barrier Diode, Metal–Semiconductor Ohmic Contacts, PN Junction Diode, Metal–Oxide–Semiconductor Field-Effect Transistor, Bipolar Transistor, Base Width Modulation, Ebers–Moll Model, Gummel–Poon Model, Large-Signal Switching, optical devices, solar cells, photodetectors, Junction Field-Effect Transistor, Photoluminescence, Electroluminescence, Luminescent Efficiency, Light Emitting Diodes, Laser Diodes, Quantum Efficiency, Power Bipolar Transistors, Gunn diode, Impatt diode, power MOSFETs, thyristor
Author: RS KHURMI, JK GUPTA
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: AME304
Topics: Engineering Materials, Engineering Properties, machine design, torsional stress, bending stress, variable stress, pressure vessels, pipes, joints, keys, coupling, shafts, levers, columns, struts, screws, belt, pulley, drives, flywheel, springs, clutches, brakes, bearings, gears, internal combustion engine
Author: EKPE OKORAFOR
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG101, ENG102, ENG201, ENG206
Topics: Industrial Safety, Hand Tools, Marking Out, Sheet Metalwork, Measuring Equipment, Cutting Tools, Cutting Fluids, Drilling, Turning Centre Lathe, Shaping, Milling, Surface Grinding, Fastening, Joining, Plastics, materials, wood, automobile, electrical work, corrosion, foundry, quality inspection
SEMICONDUCTOR DEVICES TECHNOLOGY
Author: GA CHUKWUDEBE
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ECE405
Topics: semiconductor Devices, semiconductor transistor, metals, insulators, semiconductors, Semiconductor materials, Atomic structure, chemical bonds, Rutherford Atomic Models, Bohr Atomic Models, Electron energy levels, Energy bands, Atomic bonding, Intrinsic Semiconductors, Extrinsic Semiconductors, minority carriers, majority carriers, Mass action law
Student Study Guide and Solutions Manual for Atkins and Jones’s Chemical Principles, 5th edition
Author: John Krenos, Joseph Potenza, Laurence Lavelle, Yinfa Ma, Carl Hoeger
School: Edo University
Department: Science and Technology
Course Code: CHM111
Topics: atoms, chemical bonds, molecular shape, molecular structure, Gas, liquids, solids, inorganic materials, thermodynamics, physical equilibria, chemical equilibria, acid, base, aqueous equilibria, electrochemistry, chemical kinetics, elements, nuclear chemistry, hydrocarbons, polymers, biological compounds
Semiconductor Devices (Theory and Application), Version 1.1.5
Author: James fiore
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ECE411
Topics: Atomic, Crystals, Doped Materials, N-Type Material, P-Type Material, PN Junctions, Diodes, Diode Applications, Bipolar Junction Transistors, BJTs, BJT Biasing, Amplifier, BJT Small Signal Amplifiers, Junction Field Effect Transistors, JFETs, JFET Small Signal Amplifiers, Metal Oxide Semiconductor FETs, MOSFETs, DE-MOSFET, MOSFET Small Signal Amplifiers, Class D Power Amplifiers
General Chemistry ,11th edition
Author: Darrell Ebbing, Steven Gammon
School: Federal University of Agriculture, Abeokuta
Department: Science and Technology
Course Code: CHM101
Topics: chemistry, measurement, atoms, molecules, chemical formulas, chemical reactions, gaseous state, thermochemistry, quantu, theory, electron configuration, periodicity, ionic bonding, covalent bonding, molecular geometry, chemical bonding theory, states of matter, solutions, rates of reaction, chemical equilibrium, acid, bases, acid-base equilibria, solubility, complex-ion equilibria, thermodynamics, equilibrium, electrochemistry, nuclear chemistry, Main-group elements, transition elements, coordination compounds, organic chemistry, polymer materials
Interpreting Engineering Drawings
Author: Theodore Branof
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: MEE305
Topics: line types, sketching, lettering, title blocks, circle, arcs, working drawings, projection theory, dimensioning, normal surface, inclined surface, oblique surface, pictorial sketching, machining symbols, revision blocks, chamfers, undercuts, tapers, knurls, sectional views, surface texture, conventional tolerancing, inch fits, metric fits, threads, auxiliary views, development drawings, piping drawings, bearings, manufacturing materials, casting processes, violating true projections, pin fasteners, numerical control, assembly drawings, structural steel, welding drawings, groove welds, spur gears, bevel gears, gear trains, cams, bearings, clutches, ratchet wheels, geometric dimensioning, form tolerances, datum reference frame, orientation tolerances, datum targets, position tolerance, profile tolerance, runout tolerance
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