Hydrogen Bonding Books
Author: Gyuk Musa
School: National Open University of Nigeria
Department: Science and Technology
Course Code: PHY202
Topics: atomic structure, atomic models, charge quantization, mass spectra, Bohr’s model of an atom, Hydrogen Spectra, electronic configuration, Magnetic Moment, Magnetic Dipole Moment, Electron Spin, Pauli’s Exclusive Principle, X – Spectra, Wave–Particle Duality, Radioactivity, binding energy of nuclei, Nuclear Structure, Nuclear Stability, Radioactivity, Radioactive series, Accelerators, detectors
Properties and strength Of Materials
Author: Muhannad Zedan
School: Bayero University, Kano
Department: Engineering
Course Code: CIV3308
Topics: strength Of Materials, Simple stress, simple strain, Elastic materials, Hooke's law, Modulus of elasticity, Young's modulus, Brittle materials, Poisson's ratio, Shear stress, Modulus of rigidity, Double shear, Temperature stresses, Compound bar, Cantilever beams, Simple beams, Shear force, bending moment, Shear force diagram, bending moment diagram, Torsion, Crystalline structure, Metals crystalline structure, Atomic bonding, crystal structure, Body-centered cubic structure, Face-centered cubic structure, Hexagonal close-packed structure, grain structure, grain boundary, polymorphism, Slope of beams, deflection of beams, Fatigue, creep, Fracture, Creep test, Fracture mechanics, Linear fracture mechanics, Griffith's fracture criterion
Author: Kelani Tawakalit
School: Edo University
Department: Science and Technology
Course Code: CHM123
Topics: Organic Chemistry, homologous series, functional group, organic compounds identification, Quantitative analysis, qualitative test, freeze drying, steam distillation, Chromatography, column Chromatography, electronic theory, bonding, Lewis structures, VSEPR theory, valence bond theory, valence shell electron pair repulsion theory
Author: Eziukwu Chinenye
School: Edo University
Department: Science and Technology
Course Code: CHM212
Topics: molecular orbital theory, Ionization energy, Atomic radii, oxidation state, multiple bonding, catenation, carbon allotropes, tin allotropes, Silicates
Author: EET FUTMINNA
School: Federal University of Technology, Minna
Department: Engineering
Course Code: EET216
Topics: Physics, Atomic structure, bonding, crystal structure, phase diagrams, alloying system
Introduction to engineering materials lecture digest
Author: ENGR U MARK
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207
Topics: Atomic bonding, classification of materials, atomic packaging and crystal structures, unit cells and lattice points, pyrometallurgy, hydro metallurgy, electrometallurgy
Semiconductor Physics and Devices, 4th edition
Author: Donald Neamen
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, Semiconductor Materials, atomic bonding, quantum mechanics, Statistical Mechanics, Schrodinger’s Wave Equation, Quantum Theory of Solids, energy bands, Electrical Conduction, Drift Current, electron effective mass, Dopant Atoms, Energy Levels, Extrinsic Semiconductor, Charge Neutrality, Carrier Transport Phenomena, Graded Impurity Distribution, Nonequilibrium Excess Carriers, ambipolar transport, Quasi-Fermi Energy Levels, surface effects, Metal–Semiconductor, Semiconductor Heterojunctions, tunnel diode, Schottky Barrier Diode, Metal–Semiconductor Ohmic Contacts, PN Junction Diode, Metal–Oxide–Semiconductor Field-Effect Transistor, Bipolar Transistor, Base Width Modulation, Ebers–Moll Model, Gummel–Poon Model, Large-Signal Switching, optical devices, solar cells, photodetectors, Junction Field-Effect Transistor, Photoluminescence, Electroluminescence, Luminescent Efficiency, Light Emitting Diodes, Laser Diodes, Quantum Efficiency, Power Bipolar Transistors, Gunn diode, Impatt diode, power MOSFETs, thyristor
Organic Chemistry, 6th edition
Author: Janice Gorzynski Smith
School: Edo University
Department: Science and Technology
Course Code: CHM123
Topics: Organic Chemistry, periodic table, bonding, Lewis structures, isomers, octet rule, hybridization, ethane, ethylene, acetylene, bond length, bond strength, Electronegativity, Bond Polarity, oxybenzone, Brønsted–Lowry Acids, Brønsted–Lowry Bases, acid strength, Aspirin, organic molecules, functional groups, intermolecular forces, alkanes, cycloalkanes, Substituted Cycloalkanes, lipids, Stereochemistry, starch, cellulose, glass chemistry, chiral molecules, achiral molecules, Disastereomers, meso compounds, Disubstituted Cycloalkanes, isomers, Enantiomers, organic reactions, bond breaking, bond making, Bond Dissociation Energy, thermodynamics, Enthalpy, Entropy, energy diagrams, kinetics, catalysts, enzymes, Alkyl Halides, Nucleophilic Substitution, Polar Carbon–Halogen Bond, nucleophile, Carbocation Stability, Hammond postulate, Biological Nucleophilic Substitution, Vinyl Halides, Aryl Halides, Organic Synthesis, elimination reactions, Alcohols, Ethers, Carbocation Rearrangements, Tosylate, Thials, sulfides, Alkenes, Addition Reactions, Hydrohalogenation, Lipids, Markovnikov's Rule, Halohydrin Formation, Epoxidation, alkenes, mass spectrometry, infrared spectroscopy, electromagnetic radiations, Nuclear Magnetic Resonance Spectroscopy, Magnetic Resonance Imaging, radical reactions, Conjugated Dienes, Electron Delocalization, Diels–Alder Reaction, Benzene, Aromatic Compounds, Benzene's Unusual Stability, Buckminsterfullerene, Electrophilic Aromatic Substitution, Friedel–Crafts Alkylation, Friedel–Crafts Acylation, Nucleophilic Aromatic Substitution, Carbonyl Chemistry, Organometallic Reagents, Aldehydes, Keton, Nucleophilic Addition, Carboxylic Acids, Nitriles, Aspirin, Arachidonic Acid, Prostaglandins, enols
SEMICONDUCTOR DEVICES TECHNOLOGY
Author: GA CHUKWUDEBE
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ECE405
Topics: semiconductor Devices, semiconductor transistor, metals, insulators, semiconductors, Semiconductor materials, Atomic structure, chemical bonds, Rutherford Atomic Models, Bohr Atomic Models, Electron energy levels, Energy bands, Atomic bonding, Intrinsic Semiconductors, Extrinsic Semiconductors, minority carriers, majority carriers, Mass action law
Introduction to material science tutorials and assignment work book
Author: ENG207
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207
Topics: Metallic Materials, metal, alloy, Ceramic Materials, Polymeric Materials, polymers, Composite Materials, chemical bonds, bonding, covalent bond, ionic bond, metallic bond, crystal structure, crystallography, atomic packing, Bravais lattices, crystal, unit cell, lattice point, crystallographic planes, density, Geometrical arrangement, solubility
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