Metal Alloys Books
Foundation chemistry Access chemistry
Author: AO Oyewale, FM Folarinmi
School: National Open University of Nigeria
Department: Science and Technology
Course Code: CHM001
Topics: elements, compounds, atomic theory, chemical reaction, atom constituents, chemical symbols, chemical formulae, chemical reactions, chemical equations, electronic configuration, atomic number, mass numbers, nuclear atom, electronic, energy levels, Ion formations, nuclear reactions, radioactivity, nuclear radiations, nuclear fusion, nuclear fission, radioactivity hazards, chemical bonding, electrovalent bonding, Ionic bonding, electrovalent compounds, covalent bonding, covalent compounds, coordinate covalent bonding, dative covalent bonding, metallic bonding, intermolecular bonding, Van der Waal's forces, dipole-dipole attractions, hydrogen bonding, periodic table, periodic law, transition elements, atomic orbital model, principal quantum number, subsidiary quantum number, azimuthal quantum number, magnetic quantum number, spin quantum number, atomic orbital shape, atomic size, ionic radius, ionization energy, electron affinity, electronegativity, mole concept, melting, vaporization, boiling point, evaporation sublimation, heating graphs, cooling graphs, Boyle's law, Charles's law, Avogadro's law, boiling, solid classification, solid properties, molecular solid, metallic solid, Ionic solid, covalent solid, energy changes, heat content, heat of reaction, exothermic reactions, energy level diagrams, standard state, thermochemical equations, entropy, entropy change, free energy, chemical kinetic, rate of a chemical reaction, temperature, gas pressure, catalyst, activation, reaction rate, collision theory, Le Chatelier's principle, Haber process, contact process, salt hydrolysis, buffer solutions, common Ion effect, solubility product, Acid bases, salt, electrolysis, redox reactions, electrolytic conduction, oxidation, reduction, copper purification, electroplating, quantitative hydrolysis, metal corrosion, iron rusting, carbon, carbon allotropes, Diamond graphite, amorphous carbon, combustion reactions, industrial gas chemistry, metals, alloys, chemical industry, heavy chemicals, fine chemicals, fertilizers, plastics, soaps, detergents, pharmaceuticals, Nigerian chemical industry, aromatic compounds, Alicyclic compound, heterocyclic compound, homologous series, functional groups, isomerism, structural isomerism, geometric isomerism, IUPAC Nomenclature of organic compounds, purification methods, distillation, crystallization, chromatography, empirical formula, molecular formular, alkanes, natural gas, petroleum crude oil, benzene, fractional distillation petrol quality, cracking, isomerization, petrochemicals, alkanols, alkanoic acid, alkenoate, fat, oils, amino acid, polymer chemistry, polymerization processes, condensation polymerization, resins, natural polymers, carbohydrates, proteins, synthetic polymers, water pollution
Engineering Chemistry ( Government of Tamilnadu )
Author: K.Mohan, K.SUBRAMANIAN, S.MAHALINGAM, K.HEMACHANDRAN, I.SYED AHAMED HUSSAIN
School: Federal University of Technology, Owerri
Department: Science and Technology
Course Code: CHM101
Topics: ATOMIC STRUCTURES, MOLECULAR MASS, ACIDS, BASES, SOLUTIONS, COLLOIDS, NANO PARTICLES, TECHNOLOGY OF WATER, CATALYSIS, GLASS, ELECTROCHEMISTRY, ELECTROCHEMICAL CELL, ENERGY RESOURCES, corrosion, coating, ENVIRONMENTAL CHEMISTRY, FUELS, COMBUSTION, REFRACTORIES, EXTRACTION OF METALS, POWDER, METALLURGY ALLOYS, ABRASIVES, CEMENT, CERAMICS, LUBRICANTS, ADHESIVES, POLYMERS
Materials for engineering ,Third edition
Author: John Martin
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207, ENG208
Topics: engineering materials, mechanical properties, Metals, alloys, Glass, ceramics, Organic polymeric materials, Composite materials, Crystal structure, Microstructure, tensile test, bend testing, Hardness testing, Fracture toughness testing, Glass ceramics, Cement, concrete, Bulk metallic glasses, Cellular solids
Introduction to Aircraft (Aerospace) Materials
Author: AED AFIT
School: Air Force Institute of Technology
Department: Engineering
Course Code: AED301
Topics: Aircraft Materials, Aerospace Materials, aluminum, Titanium, Magnesium, steel, super alloys, Fibre–polymer composites, Fibre–metal laminates, Factor of safety, Design factor, safety factor, Network Polymers, Deformation mechanisms, Semi crystalline polymers, plastic polymers, elastomers deformation mechanism, Thermoplastics, Thermosets, Time-Dependent Deformation, Stress relaxation test, Advanced Polymers, Ultrahigh Molecular Weight Polyethylene
Semiconductor Physical Electronics, 2nd edition
Author: Sheng Li
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, solids, crystal structure, lattice dynamics, semiconductor statistics, Energy Band Theory, Bloch–Floquet Theorem, Kronig–Penney Model, Band-to-Band Radiative Recombination, Band-to-Band Auger Recombination, Charge-Neutrality Equation, Haynes–Shockley Experiment, Photoconductivity Decay Experiment, Impurity Scattering, Phonon Scattering, p-n Junction Diodes, photoelectric effects, solar cells, photodetectors, light-emitting devices, Bipolar Junction Transistors, Metal-Oxide-Semiconductor Field-Effect Transistors, Metal–Semiconductor Field-Effect Transistors, High Electron Mobility Transistors, Hot-Electron Transistors, Resonant Tunneling Devices, Transferred-Electron Devices, Advanced Bipolar Junction Transistors, Heterojunction Bipolar Transistors, thyristors, Zener Breakdowns, Avalanche Breakdowns, tunnel diodes, Thermionic Emission Theory, Metal Work Function, Schottky Effect, ideal Schottky contact
Semiconductor Physics and Devices, 4th edition
Author: Donald Neamen
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, Semiconductor Materials, atomic bonding, quantum mechanics, Statistical Mechanics, Schrodinger’s Wave Equation, Quantum Theory of Solids, energy bands, Electrical Conduction, Drift Current, electron effective mass, Dopant Atoms, Energy Levels, Extrinsic Semiconductor, Charge Neutrality, Carrier Transport Phenomena, Graded Impurity Distribution, Nonequilibrium Excess Carriers, ambipolar transport, Quasi-Fermi Energy Levels, surface effects, Metal–Semiconductor, Semiconductor Heterojunctions, tunnel diode, Schottky Barrier Diode, Metal–Semiconductor Ohmic Contacts, PN Junction Diode, Metal–Oxide–Semiconductor Field-Effect Transistor, Bipolar Transistor, Base Width Modulation, Ebers–Moll Model, Gummel–Poon Model, Large-Signal Switching, optical devices, solar cells, photodetectors, Junction Field-Effect Transistor, Photoluminescence, Electroluminescence, Luminescent Efficiency, Light Emitting Diodes, Laser Diodes, Quantum Efficiency, Power Bipolar Transistors, Gunn diode, Impatt diode, power MOSFETs, thyristor
Engineering workshop and safety
Author: MEE FUOYE
School: Federal University, Oye-Ekiti
Department: Engineering
Course Code: MEE201
Topics: Engineering workshop, safety, workshop layout, Gas Leakage, accident, accident prevention techniques, fire, fire triangle, fire tetrahedron, fire extinguisher, fitting, steel rule, calipers, surface plate, punches, Vernier height guage, twist drill, chisel, bench drilling machine, bench vice, forging, carpentry, holding tools, work bench, sheet metal work, measuring tools, Sheet Metal Gauge, cutting tools, joining tools, metal joining process, welding
Introduction to Basic Manufacturing Processes and Workshop Technology
Author: Rajender singh
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: MEE303
Topics: Industrial Safety, Ferrous Materials, Non-Ferrous Materials, Melting Furnaces, Heat Treatment, Carpentry, Pattern and Core Making Foundry Tools, Foundry Equipments, Mold, Core Making, casting, forging, hot working of metals, cold working, welding, sheet metal work, fitting, metal cutting, lathe machine, drilling machine, sharpner, planer, slotter, milling, powder metallurgy, inspection, quality control
Concise Inorganic Chemistry, 5th edition
Author: JD Lee
School: University of Ilorin
Department: Science and Technology
Course Code: CHE127, CHE227
Topics: atomic structure, bonding, periodic table, ionic bond, covalent bond, metallic bond, coordination bond, hydrogen, hydride, alkali metal, alkaline earth metal, chalcogen, group 2 element, group 13 element, S-block element, P-block element, group 14 element, group 15 element, group 16 element, halogen, group 17 element, halogen oxide, noble gas, transition element, scandium group, titanium group, vanadium group, chromium group, manganese group, iron group, cobalt group, nickel group, copper group, zinc group, Bohr theory, Pauli exclusion principle, atomic spectra, Hund rule, solubility, conductivity, lattice energy, stochiometric defect, schottky defect, Lewis theory, octet rule, sidgwick-powell theory, VSEPR theory, isoelectronic principle, Heisenberg uncertainty principle, radial function, angular function
Author: Gaurav Tripathi
School: University of Nigeria, Nsukka
Department: Engineering
Course Code: EGR201
Topics: Materials Science, materials Engineering, Rutherford model, Bohr model, atom, De- Broglie’s atomic model, Atomic bonding, ionic bonding, covalent bonding, Secondary Bonding, metallic bonding, Fluctuating Induced Dipole Bonds, Polar Molecule-Induced Dipole Bonds, Permanent Dipole Bonds, Crystallography, crystal structures, Crystal Lattice, Bravais lattices, Metallic Crystal Structures, Polycrystalline Materials, Non-Crystalline Solids, Miller Indices, Point Defects, Mechanical Properties of Metals, Stress-Strain curve, Elastic deformation, plastic deformation, Tensile Properties, Brinell Hardness Test, Micro-hardness Test, Knoop Hardness Test, Scleroscope Hardness Test, durometer, fracture, creep, dislocation, Solid-Solution Strengthening, Microstructural Exam, Grain size determination, carbon steel, cast iron, alloy, Dielectric Materials, Dielectric strength, Intrinsic dielectric strength, Magnetic Properties, Diamagnetism, Ferromagnetism, Ferrimagnetism, Hard Magnetic Materials, Extrinsic Semiconductor, semiconductor
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