Metal Casting Books
Semiconductor Physical Electronics, 2nd edition
Author: Sheng Li
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, solids, crystal structure, lattice dynamics, semiconductor statistics, Energy Band Theory, Bloch–Floquet Theorem, Kronig–Penney Model, Band-to-Band Radiative Recombination, Band-to-Band Auger Recombination, Charge-Neutrality Equation, Haynes–Shockley Experiment, Photoconductivity Decay Experiment, Impurity Scattering, Phonon Scattering, p-n Junction Diodes, photoelectric effects, solar cells, photodetectors, light-emitting devices, Bipolar Junction Transistors, Metal-Oxide-Semiconductor Field-Effect Transistors, Metal–Semiconductor Field-Effect Transistors, High Electron Mobility Transistors, Hot-Electron Transistors, Resonant Tunneling Devices, Transferred-Electron Devices, Advanced Bipolar Junction Transistors, Heterojunction Bipolar Transistors, thyristors, Zener Breakdowns, Avalanche Breakdowns, tunnel diodes, Thermionic Emission Theory, Metal Work Function, Schottky Effect, ideal Schottky contact
Semiconductor Physics and Devices, 4th edition
Author: Donald Neamen
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, Semiconductor Materials, atomic bonding, quantum mechanics, Statistical Mechanics, Schrodinger’s Wave Equation, Quantum Theory of Solids, energy bands, Electrical Conduction, Drift Current, electron effective mass, Dopant Atoms, Energy Levels, Extrinsic Semiconductor, Charge Neutrality, Carrier Transport Phenomena, Graded Impurity Distribution, Nonequilibrium Excess Carriers, ambipolar transport, Quasi-Fermi Energy Levels, surface effects, Metal–Semiconductor, Semiconductor Heterojunctions, tunnel diode, Schottky Barrier Diode, Metal–Semiconductor Ohmic Contacts, PN Junction Diode, Metal–Oxide–Semiconductor Field-Effect Transistor, Bipolar Transistor, Base Width Modulation, Ebers–Moll Model, Gummel–Poon Model, Large-Signal Switching, optical devices, solar cells, photodetectors, Junction Field-Effect Transistor, Photoluminescence, Electroluminescence, Luminescent Efficiency, Light Emitting Diodes, Laser Diodes, Quantum Efficiency, Power Bipolar Transistors, Gunn diode, Impatt diode, power MOSFETs, thyristor
Engineering workshop and safety
Author: MEE FUOYE
School: Federal University, Oye-Ekiti
Department: Engineering
Course Code: MEE201
Topics: Engineering workshop, safety, workshop layout, Gas Leakage, accident, accident prevention techniques, fire, fire triangle, fire tetrahedron, fire extinguisher, fitting, steel rule, calipers, surface plate, punches, Vernier height guage, twist drill, chisel, bench drilling machine, bench vice, forging, carpentry, holding tools, work bench, sheet metal work, measuring tools, Sheet Metal Gauge, cutting tools, joining tools, metal joining process, welding
Concise Inorganic Chemistry, 5th edition
Author: JD Lee
School: University of Ilorin
Department: Science and Technology
Course Code: CHE127, CHE227
Topics: atomic structure, bonding, periodic table, ionic bond, covalent bond, metallic bond, coordination bond, hydrogen, hydride, alkali metal, alkaline earth metal, chalcogen, group 2 element, group 13 element, S-block element, P-block element, group 14 element, group 15 element, group 16 element, halogen, group 17 element, halogen oxide, noble gas, transition element, scandium group, titanium group, vanadium group, chromium group, manganese group, iron group, cobalt group, nickel group, copper group, zinc group, Bohr theory, Pauli exclusion principle, atomic spectra, Hund rule, solubility, conductivity, lattice energy, stochiometric defect, schottky defect, Lewis theory, octet rule, sidgwick-powell theory, VSEPR theory, isoelectronic principle, Heisenberg uncertainty principle, radial function, angular function
Author: Gaurav Tripathi
School: University of Nigeria, Nsukka
Department: Engineering
Course Code: EGR201
Topics: Materials Science, materials Engineering, Rutherford model, Bohr model, atom, De- Broglie’s atomic model, Atomic bonding, ionic bonding, covalent bonding, Secondary Bonding, metallic bonding, Fluctuating Induced Dipole Bonds, Polar Molecule-Induced Dipole Bonds, Permanent Dipole Bonds, Crystallography, crystal structures, Crystal Lattice, Bravais lattices, Metallic Crystal Structures, Polycrystalline Materials, Non-Crystalline Solids, Miller Indices, Point Defects, Mechanical Properties of Metals, Stress-Strain curve, Elastic deformation, plastic deformation, Tensile Properties, Brinell Hardness Test, Micro-hardness Test, Knoop Hardness Test, Scleroscope Hardness Test, durometer, fracture, creep, dislocation, Solid-Solution Strengthening, Microstructural Exam, Grain size determination, carbon steel, cast iron, alloy, Dielectric Materials, Dielectric strength, Intrinsic dielectric strength, Magnetic Properties, Diamagnetism, Ferromagnetism, Ferrimagnetism, Hard Magnetic Materials, Extrinsic Semiconductor, semiconductor
COMPUTER PROGRAMMING FOR ENGINEERING APPLICATIONS
Author: ATIMATI EHINOMEN
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG214
Topics: Control of codes, Decision loops, Iterative loops, Iterative loops/statements, Break, Real number, statement, Continue statement, Data Type conversion (casting), Constants, variable, objects
Interpreting Engineering Drawings
Author: Theodore Branof
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: MEE305
Topics: line types, sketching, lettering, title blocks, circle, arcs, working drawings, projection theory, dimensioning, normal surface, inclined surface, oblique surface, pictorial sketching, machining symbols, revision blocks, chamfers, undercuts, tapers, knurls, sectional views, surface texture, conventional tolerancing, inch fits, metric fits, threads, auxiliary views, development drawings, piping drawings, bearings, manufacturing materials, casting processes, violating true projections, pin fasteners, numerical control, assembly drawings, structural steel, welding drawings, groove welds, spur gears, bevel gears, gear trains, cams, bearings, clutches, ratchet wheels, geometric dimensioning, form tolerances, datum reference frame, orientation tolerances, datum targets, position tolerance, profile tolerance, runout tolerance
The Science and Engineering of Materials ,Seventh Edition
Author: Donald Askeland, Wendelin Wright
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207, ENG208
Topics: Materials Design, Atomic Structure, Atomic Bonding, interatomic spacing, amorphous materials, lattice, basis, unit cells, crystal structure, Allotropic Transformation, Polymorphic Transformation, Crystal Structures, unit cell, Covalent Structures, diffusion, Fick’s Law, Mechanical Properties, Tensile Test, stress, strain, Nanoindentation, Fracture Mechanics, Fatigue, Fatigue Test, creep, rupture, stress corrosion, Strain Hardening, Annealing, Hot Working, Nucleation, cooling curves, cast structure, casting, Directional Solidification, Single Crystal Growth, Epitaxial Growth, Phase Diagram, Phase Equilibrium, Dispersion Strengthening, Eutectic Phase Diagrams, Eutectoid Reaction, Martensitic Reaction, Tempering, Nonferrous Alloys, Glass-Ceramics, Polymers, Polymerization, Thermoplastics, elastomers, rubbers, adhesives, Composites, Particulate Composites, Fiber-Reinforced Composites, plywood, concrete, asphalt, Electronic Materials, semiconductors, insulators, Electrostriction, Piezoelectricity, Ferroelectricity, Magnetic Materials, Magnetization
The science and engineering of materials Instructors‘ Solution Manual, Fourth Edition
Author: Frank Askeland, Pradeep Phulé, Gregory Lea
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207, ENG208
Topics: Materials Design, Atomic Structure, Atomic Bonding, interatomic spacing, amorphous materials, lattice, basis, unit cells, crystal structure, Allotropic Transformation, Polymorphic Transformation, Crystal Structures, unit cell, Covalent Structures, diffusion, Fick’s Law, Mechanical Properties, Tensile Test, stress, strain, Nanoindentation, Fracture Mechanics, Fatigue, Fatigue Test, creep, rupture, stress corrosion, Strain Hardening, Annealing, Hot Working, Nucleation, cooling curves, cast structure, casting, Directional Solidification, Single Crystal Growth, Epitaxial Growth, Phase Diagram, Phase Equilibrium, Dispersion Strengthening, Eutectic Phase Diagrams, Eutectoid Reaction, Martensitic Reaction, Tempering, Nonferrous Alloys, Glass-Ceramics, Polymers, Polymerization, Thermoplastics, elastomers, rubbers, adhesives, Composites, Particulate Composites, Fiber-Reinforced Composites, plywood, concrete, asphalt, Electronic Materials, semiconductors, insulators, Electrostriction, Piezoelectricity, Ferroelectricity, Magnetic Materials, Magnetization
Editing & Graphics of Communication
Author: Oladokun Omojola
School: National Open University of Nigeria
Department: Administration, Social and Management science
Course Code: MAC221
Topics: Typography, graphic process, Text Editing, editing, Headline Casting, Text Graphics, Image Editing, Photographs, Caption Writing, Printing Process
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