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Semiconductor devices technology past question for the year 2020 examines 400-level Engineering students of FUTO, offering ECE405 course on their knowledge of Semiconductor devices technology, VLSI fabrication oxidation process, IC fabrication process, Fick's law, Epitaxial layer growth, metallization, IC manufacturing, Czochralski crystals, energy band diagram, Fermi level, valence bands, conductor band, photolithography, forbidden energy gap, intrinsic semiconductor, extrinsic semiconductor, Intel Pentium microprocessor, Ion implantation

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Past Questions related to Semiconductor devices technology

SEMI CONDUCTOR DEVICES TECHNOLOGY

Year: 2017

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ECE405

Topics: Fick's law, IC fabrication, energy band, semiconductor

Microprocessor and microcomputer systems and applications

Year: 2020

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: microprocessor address space, semiconductor memory, 8085 microprocessor, Intel 8085 microprocessor architecture, register organization, stack pointer, memory address register, control generator, register selector, addressing modes, instructions, assembly program, accumulator, 8085 program model

Basic electronics-2012,2013,2014,2017,2018

Year: 2018

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE202

Topics: energy band, semiconductor, electron, fermi-dirac, diode, triode, fermi function, fermi, Pauli exclusion principle

BASIC ELECTRONICS-TEST&EXAM

Year: 2018

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE202

Topics: energy band, conductors, insulators, semi conductors, valence electron, Fermi function, Fermi-Dirac, conductivity, mobility

Advanced electronic 2

Year: 2019

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ECE502

Topics: Advanced electronic, signals transmission, 2-port network, transverse-electromagnetic modes, transverse magnetic modes, electromagnetic compatibility, electromagnetic interference, electromagnetic vulnerability tests, microwave system, 2-cavity klystron amplifiers, magnetron, slow wave structure, reduced attenuation, quarter-wavelength, transformer, attenuation in wave guides, band-pass filter, band mode filter, Iris component equivalent, solid state devices, quantum electronic devices

MATERIALS TECHNOLOGY

Year: 2019

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MCE403

Topics: MATERIALS TECHNOLOGY, materials, steam plant, corrosion, rotor, fiber optic, conductivity, semi conductor, super conductor, oxide, reaction, heat transfer, steady-state, transient, sensor

Manufacturing process 3

Year: 2020

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: IPE507

Topics: Manufacturing process, ultrasonic machining, unconventional machining methods, machined surface accuracy, electrochemical machining, powder metallurgy, gear machining, manufacturing gears, electron beam machining, electro discharge machining

Organoleptic factors of food

Year: 2020

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: FST533

Topics: Food organoleptic factors, food organoleptic evaluation, food extrinsic organoleptic factors, food intrinsic organoleptic factors, food colour, food product development, food moisture content, water sorption isotherm, humectants, food moisture estimation, drying curve water activity, control water activity

Materials for biomedical applications

Year: 2020

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MAE525

Topics: Biomaterial devices, biomaterials, hearing aids, wearable artificial limbs, biomaterial fabrication, blood vessels, bone replacement, dental replacement, ear replacement, bioceramics, wound-healing process, metallic biomaterials corrosion, biosensor, biosensor application, titanium alloys, dental implants

Manufacturing process

Year: 2020

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MEE303

Topics: Centre Lathe Machine, Turret Lathe Machine, Shaping Machine, Milling Machine, Indexing, Workholding, Manufacturing process, Lathe Machine

ELECTRICAL,OPTICAL&MAGNETIC MATERIALS & DEVICES

Year: 2019

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MAE421

Topics: ELECTRICAL, OPTICAL, MAGNETIC MATERIALS, eleven-nine purity, alloy, IC, semiconductors, silicon, transformer, conductor, dielectric, magnetic, resistor, electro-optical, signal-processing

Manufacturing technology 1

Year: 2018

School: University of Benin

Department: Engineering

Course Code: PRE211

Topics: Manufacturing technology, Rubber, metal, joining process, welding process, electrode, glass, forging, flame

MICROPROCESSOR AND MICROCOMPUTER SYSTEMS AND APPLICATIONS

Year: 2019

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: 8085 microprocessor, CPU, Interrupt, Addressing mode, program counter, EEPROM

MICROPROCESSOR AND MICROCOMPUTER SYSTEMS AND APPLICATIONS-2016&2017

Year: 2017

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: Microprocessor, 8085, Demultiplexing, RAM, EPROM

Books related to Semiconductor devices technology

SEMICONDUCTOR DEVICES TECHNOLOGY

Author: GA CHUKWUDEBE

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ECE405

Topics: semiconductor Devices, semiconductor transistor, metals, insulators, semiconductors, Semiconductor materials, Atomic structure, chemical bonds, Rutherford Atomic Models, Bohr Atomic Models, Electron energy levels, Energy bands, Atomic bonding, Intrinsic Semiconductors, Extrinsic Semiconductors, minority carriers, majority carriers, Mass action law

Semiconductor Physics and Devices, 4th edition

Author: Donald Neamen

School: Edo University

Department: Engineering

Course Code: EEE315

Topics: Semiconductor, Semiconductor Materials, atomic bonding, quantum mechanics, Statistical Mechanics, Schrodinger’s Wave Equation, Quantum Theory of Solids, energy bands, Electrical Conduction, Drift Current, electron effective mass, Dopant Atoms, Energy Levels, Extrinsic Semiconductor, Charge Neutrality, Carrier Transport Phenomena, Graded Impurity Distribution, Nonequilibrium Excess Carriers, ambipolar transport, Quasi-Fermi Energy Levels, surface effects, Metal–Semiconductor, Semiconductor Heterojunctions, tunnel diode, Schottky Barrier Diode, Metal–Semiconductor Ohmic Contacts, PN Junction Diode, Metal–Oxide–Semiconductor Field-Effect Transistor, Bipolar Transistor, Base Width Modulation, Ebers–Moll Model, Gummel–Poon Model, Large-Signal Switching, optical devices, solar cells, photodetectors, Junction Field-Effect Transistor, Photoluminescence, Electroluminescence, Luminescent Efficiency, Light Emitting Diodes, Laser Diodes, Quantum Efficiency, Power Bipolar Transistors, Gunn diode, Impatt diode, power MOSFETs, thyristor

Semiconductor Physical Electronics, 2nd edition

Author: Sheng Li

School: Edo University

Department: Engineering

Course Code: EEE315

Topics: Semiconductor, solids, crystal structure, lattice dynamics, semiconductor statistics, Energy Band Theory, Bloch–Floquet Theorem, Kronig–Penney Model, Band-to-Band Radiative Recombination, Band-to-Band Auger Recombination, Charge-Neutrality Equation, Haynes–Shockley Experiment, Photoconductivity Decay Experiment, Impurity Scattering, Phonon Scattering, p-n Junction Diodes, photoelectric effects, solar cells, photodetectors, light-emitting devices, Bipolar Junction Transistors, Metal-Oxide-Semiconductor Field-Effect Transistors, Metal–Semiconductor Field-Effect Transistors, High Electron Mobility Transistors, Hot-Electron Transistors, Resonant Tunneling Devices, Transferred-Electron Devices, Advanced Bipolar Junction Transistors, Heterojunction Bipolar Transistors, thyristors, Zener Breakdowns, Avalanche Breakdowns, tunnel diodes, Thermionic Emission Theory, Metal Work Function, Schottky Effect, ideal Schottky contact

Material Science

Author: SL Kakani

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ENG207, ENG208

Topics: Atomic Structure, Electronic Configuration, Crystal Geometry, Crystal Structure, Crystal Defects, bond, electron theory, Photoelectric Effect, diffusion, mechanical test, alloy, phase diagram, phase transformation, heat treatment, deformation, oxidation, corrosion, thermal properties, optical properties, electrical properties, magnetic properties, semiconductors, superconductivity, polymers, elastomers, organic materials, composites, nanostructure, spintronics, crystal, whiskers, unit cell, Co-ordination Number, crystal Imperfections, Anisotropy, Frank-Read Source, Crystal Growth, bond, Drude-Lorentz Theory, Metallic Bonding, . Fermi-Dirac, Sommerfield Free-Electron Theory, Brillouin Zones, Energy Bands, Resistivity, Conductivity, Thermoelectricity, Einstein’s Photoelectric Equation, Photoelectric Cell, Fick’s Laws, Surface Diffusion, Atomic Model, Mechanical Tests, Hume-Rothery’s Rules, Lever Rule, Annealing, Mass Effect, Pyrometers, Elastic Deformation, Plastic Deformation, Twinning, Work Hardening, Strain Hardening, Season Cracking

A Textbook of Mechatronics

Author: RK Rajput

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MCE202

Topics: Mechatronics, control systems, microcontroller, electronic devices, semiconductor, diode, transistor, digital electronics, sensors, transducers, strain gauges, load cells, proximity sensors, light sensors, digital optical encoder, signal conditioning, amplification, amplifier, optical amplifier, data acquisition, analog-to-digital converter, digital-to-analog converter, digital signal transmission, microprocessors, microprocessor systems, Intel 8085 microprocessor, system models, mechanical system building blocks, electrical system building blocks, fluid system building blocks, thermal system building blocks, controllers, PID controllers, digital controllers, adaptive control system, programmable logic controllers, actuators, mechanical actuators, electrical actuators, DC motors, single phase motors, three phase induction motors, synchronous motors, hydraulic actuators, pumps, pressure regulator, hydraulic valves, linear actuators, rotary actuators, pneumatic actuators, mechatronic systems, embedded systems, CNC machines, CAD, CAM, Machine structure, drives, spindle, spindle bearings, swarf removal

Principles of Chemical Engineering Processes Material and Energy Balances

Author: Nayef Ghasem, Redhouane Henda

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: CHE202

Topics: Chemical Engineering Processes, Material Balance, Energy Balance, temperature measurement, temperature conversion, dimensional homogeneity, dimensionless quantities, process flow sheet, process unit, process streams, mass flow rates, volumetric rates, moles, molecular weight, stream composition, mass fraction, mole fraction, concentration, pressure measurement, pressure-sensing devices, process units, degrees of freedom analysis, process flow diagram, multiunit process flow diagram, mass balance, Stoichiometric Equation, Stoichiometric Coefficients, Stoichiometric Ratio, Limiting Reactant, Excess Reactants, Combustion Reactions, Chemical Equilibrium, Multiple-Unit Process Flowcharts, Single-Phase Systems, Multiphase Systems, Ideal Gas Equation of State, liquid density, solid density, gas density, Real Gas Relationships, Compressibility Factor, Virial Equation of State, van der Waals Equation of State, Soave–Redlich–Kwong Equation of State, Kay’s Mixing Rules, phase diagram, Vapor–Liquid Equilibrium Curve, Vapor Pressure Estimation, Clapeyron Equation, Clausius–Clapeyron Equation, Cox Chart, Antoine Equation, Partial Pressure, Dalton’s Law of Partial Pressures, Gibbs’ Phase Rule, Bubble Point, Dew Point, Critical Point, Kinetic Energy, Potential Energy, energy balance, steam turbine, heaters, coolers, compressors, Mechanical Energy Balance, Enthalpy Calculations, Constant Heat Capacity, Psychrometric Chart, Heat of Reaction, Heats of Formation, Heat of Combustion, Heat of Reaction Method, Unsteady-State Material Balance, Unsteady-State Energy Balance

Manufacturing Engineering And Technology, Seventh Edition

Author: Steven Schmid, Serope Kalpakjian

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MCE304

Topics: structure of metals, mechanical behavior of metals, manufacturing properties of metals, metal alloys, heat treatment, ferrous metals, alloy, Nonferrous metals, alloys, polymers, ceramic, glass, graphite, diamond, nano materials, composite materials, metal-casting processes, metal-casting equipment, metal casting, metal-rolling, metal-forging, metal extrusion, drawing processes, sheet-metal forming processes, powder metal, superconductors, plastics, rapid-prototyping processes, machining, cutting-tool materials, cutting fluids, machining processes, machining centers, machine-tool structures, machining economics, abrasive finishing, finishing operations, micromanufacturing, microelectronics devices, solid-welding processes, brazing, soldering, adhesive-bonding, mechanical fastening, surface technology, engineering metrology, instrumentation, quality assurance, computer-integrated manufacturing, computer-aided manufacturing

Mechanisms and Mechanical Devices Source book, 5th Edition

Author: Neil Sclater

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: AME306

Topics: motion control systems, stationary robots, mobile robots, RENEWABLE POWER GENERATION, Linkages, gears, cam, geneva, ratchet drive, clutches, brake, latching, fastening, clamp devices, chain devices, belt devices, spring devices, screw devices, shaft, motion-specific devices, packaging, handling, conveying, torque, tension, limit control systems, digital prototypes

The Science and Engineering of Materials ,Seventh Edition

Author: Donald Askeland, Wendelin Wright

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ENG207, ENG208

Topics: Materials Design, Atomic Structure, Atomic Bonding, interatomic spacing, amorphous materials, lattice, basis, unit cells, crystal structure, Allotropic Transformation, Polymorphic Transformation, Crystal Structures, unit cell, Covalent Structures, diffusion, Fick’s Law, Mechanical Properties, Tensile Test, stress, strain, Nanoindentation, Fracture Mechanics, Fatigue, Fatigue Test, creep, rupture, stress corrosion, Strain Hardening, Annealing, Hot Working, Nucleation, cooling curves, cast structure, casting, Directional Solidification, Single Crystal Growth, Epitaxial Growth, Phase Diagram, Phase Equilibrium, Dispersion Strengthening, Eutectic Phase Diagrams, Eutectoid Reaction, Martensitic Reaction, Tempering, Nonferrous Alloys, Glass-Ceramics, Polymers, Polymerization, Thermoplastics, elastomers, rubbers, adhesives, Composites, Particulate Composites, Fiber-Reinforced Composites, plywood, concrete, asphalt, Electronic Materials, semiconductors, insulators, Electrostriction, Piezoelectricity, Ferroelectricity, Magnetic Materials, Magnetization

The science and engineering of materials Instructors‘ Solution Manual, Fourth Edition

Author: Frank Askeland, Pradeep Phulé, Gregory Lea

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ENG207, ENG208

Topics: Materials Design, Atomic Structure, Atomic Bonding, interatomic spacing, amorphous materials, lattice, basis, unit cells, crystal structure, Allotropic Transformation, Polymorphic Transformation, Crystal Structures, unit cell, Covalent Structures, diffusion, Fick’s Law, Mechanical Properties, Tensile Test, stress, strain, Nanoindentation, Fracture Mechanics, Fatigue, Fatigue Test, creep, rupture, stress corrosion, Strain Hardening, Annealing, Hot Working, Nucleation, cooling curves, cast structure, casting, Directional Solidification, Single Crystal Growth, Epitaxial Growth, Phase Diagram, Phase Equilibrium, Dispersion Strengthening, Eutectic Phase Diagrams, Eutectoid Reaction, Martensitic Reaction, Tempering, Nonferrous Alloys, Glass-Ceramics, Polymers, Polymerization, Thermoplastics, elastomers, rubbers, adhesives, Composites, Particulate Composites, Fiber-Reinforced Composites, plywood, concrete, asphalt, Electronic Materials, semiconductors, insulators, Electrostriction, Piezoelectricity, Ferroelectricity, Magnetic Materials, Magnetization

Electronic properties of materials

Author: Paul Nnamchi

School: University of Nigeria, Nsukka

Department: Engineering

Course Code: EGR201

Topics: Electronic properties, Conductors, dielectric materials, Insulators, dielectrics, semiconductors, Insulator Energy Bands, band theory, Semiconductor Energy Bands, Electrical Conductivity, Doped Semiconductors, metal, alloy

Introduction to Materials for Advanced Energy Systems

Author: Colin Tong

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MCE403

Topics: Advanced Energy Systems, Energy resource, energy system development, energy process characterization, energy calculations, energy accounting, sustainable energy development, Dynamic Mechanical Spectroscopy, nano-scale material, micro-scale material, nanoindentation, optical microscopy, electron microscopy, atom probe tomography, advanced x-ray characterization, neutron scattering, phase transformation temperatures, density, specific gravity, thermal conductivity, thermal expansion, electrical conductivity, electrical resistivity, permittivity, permeability, corrosion, oxidation, toughness, materials design, materials modeling, advanced coatings, photovoltaic materials, hybrid solar cells, thermal storage materials, phase change materials, Geothermal electricity, geothermal heat pump, wind resources, wind machinery, energy-generating systems, wind turbine, hydropower technology, ocean energy, hydrogen generation technology, fuel cells, advanced nuclear energy, fission reactors, fusion reactors, thermoelectric materials, piezoelectric materials, pyroelectric materials, magnetostrictive materials, multiferroic magnetoelectric materials, triboelectric materials, artificial photosynthesis

Lecture Note On Microprocessor and Microcontroller Theory and Applications

Author: EEE

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: Microprocessor architecture, use of stack, sub routines, interfacing, support chips, EPROM, RAM, Advanced microprocessor, microcontroller, addressing modes

Microprocessor

Author: tutorials point

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: Microprocessor, 8085 MICROPROCESSOR, 8085 Pin Configuration, Addressing Modes, Interrupts, Instruction Sets, Control Instructions, Branching Instructions, Arithmetic Instructions

Understanding 8085 and 8086 Microprocessors and Peripheral ICs

Author: SK Sen

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: 8085 Microprocessor, 8086 Microprocessor, Peripheral ICs, Microprocessor, Microcomputer, Instruction Types, Timing Diagrams, 8085 Interrupts, Programming Techniques, Stack, Subroutines, Data Transfer Technique, Interfacing Memories and I/Os, memory, peripheral chip, bus standard, memory organisation, addressing modes, Modular Program Development, Assembler Directives, Input/Output Interface of 8086, 8086 Interrupts, 8288 Bus Controller, 8087 Numeric Data Processor, 8089 I/O Processor, 8289 Bus Arbiter

Microprocessor systems and applications Lecture Note

Author: IE Achumba, Reginald okpara

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: EEE401

Topics: 8085 Microprocessor, system bus, Demultiplexing address line, Demultiplexing data line, Memory interfacing, Memory address decoding, Address decoding, addressing mode, interrupts, instruction execution, timing diagram

Materials Science and Engineering An Introduction,10th edition

Author: William Callister, David Rethwish

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ENG207, ENG208

Topics: atomic structure, interatomic bonding, crystalline solids, crystals, atomic bonding, diffusion, dislocation, strengthening mechanisms, failure, mechanical properties, phase diagrams, phase transformations, alloy, ceramic, polymer, corrosion, degradation, composites, polymer synthesis, polymer processing, oxidation, electrical properties, magnetic properties, optical properties, thermal properties, unit cell, density computation, Polymorphism, Allotropy, Crystallographic points, Crystallographic directions, polycrystalline materials, anisotropy, X-ray diffraction, plastic deformation, point defects, atomic vibration, fick's law, Stress–Strain Behavior, Anelasticity, fatigue, creep, solubility limit, phase equilibria

Materials Science and Engineering, An Introduction ,8th Edition Solution Manual

Author: William Callister

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: ENG207, ENG208

Topics: atomic structure, interatomic bonding, crystalline solids, crystals, atomic bonding, diffusion, dislocation, strengthening mechanisms, failure, mechanical properties, phase diagrams, phase transformations, alloy, ceramic, polymer, corrosion, degradation, composites, polymer synthesis, polymer processing, oxidation, electrical properties, magnetic properties, optical properties, thermal properties, unit cell, density computation, Polymorphism, Allotropy, Crystallographic points, Crystallographic directions, polycrystalline materials, anisotropy, X-ray diffraction, plastic deformation, point defects, atomic vibration, fick's law, Stress–Strain Behavior, Anelasticity, fatigue, creep, solubility limit, phase equilibria

Computer Aided Design/Computer Aided Manufacturing

Author: Gerald Onuoha

School: Federal University of Technology, Owerri

Department: Engineering

Course Code: MEE505

Topics: Computer Aided Design, Computer Aided Manufacturing, computer integrated manufacturing, computer aided techniques, flexible manufacturing system, CNC programming, Lathe operation, CNC milling chamfering

Concrete Technology Theory and Practice, Multicolour Edition

Author: MS Shetty

School: Bayero University, Kano

Department: Engineering

Course Code: CIV5307

Topics: Concrete technology, Cements, Modern cements history, Portland cement manufacturing, Portland cement wet process manufacturing, Portland cement dry process manufacturing, Cement chemical composition, Cements hydration, Heat of hydration, Calcium silicate hydrates, Calcium hydroxide, calcium aluminate hydrates, hydrated cements structure, Water requirement for hydration, Cement types, ASTM cements classification, Ordinary Portland cement, Rapid hardened cement, Extra rapid hardening cement, Portland slag cement, Quick setting cement, super sulphated cement, low heat cement, Portland pozzolana cement, coloured cement, hydrophobic cement, masonry cement, expansive cement, Cement testing, Aggregates, aggregates testing, Aggregates form igneous rock, aggregates from sedimentary rocks, aggregates from metamorphic rock, aggregate crushing value, aggregates impact value, aggregate abrasion value, Deval attrition test, Dorry Abrasion test, Los Angeles test, modulus of elasticity, bulk density, specific gravity, Sieve analysis, Aggregates testing, Water, water qualities, Sea water for mixing concrete, Admixture, construction chemicals, Plasticizers, water reducers, Workability, Plasticizers action, Superplasticizers classification, Factors affecting workability, Superplasticizers types, Fresh concrete, Fresh concrete water content, Fresh concrete mix proportions, Aggregates sizes in fresh concrete, Aggregates shape, Surface texture, Admixture use in fresh concrete, Workability measurement, Slump test, k-slump test, aggregates grading, compacting factor test, flow test, flow table apparatus, vee bee consistometer test, setting of concrete, Manufacture of concrete process, Concrete compaction, Concrete curing, Concrete strength, Water-cement ratio, Strength gaining with age, Concrete maturity concept, Bond strength, High strength concrete, Elasticity, Creep, Shrinkage, Aggregates elastic properties, Modulus of Elasticity, Dynamic modulus of elasticity, Poison's ratio, Creep rheological representation, Creep measurement, Factors affecting creep, Aggregate influence, Mix proportion influence, Shrinkage, Plastic Shrinkage, Drying Shrinkage, Moisture movement, Autogenous Shrinkage, Carbonation shrinkage, Concrete Durability, Strength to Durability relationship, Concrete volume change, Durability definition, durability significance, Permeability, Cement paste permeability, Concrete permeability, Plastic shrinkage cracks, Settlement cracks, Thermal shrinkage, Hardened concrete testing, Concrete mix design, Special concrete, concrete methods

Tests related to Semiconductor devices technology

Physics (JAMB)

School: WAEC, JAMB & POST UTME

Department:

Course Code: JAMB

Topics: Physics, JAMB, Friction, work, force, motion, speed, velocity, energy, hydraulic press, relative density, hydrometer, gas law, sound wave, wave, light, mirror,capacitor, electricity, pressure